Three Dimensional Transient Cooling of electronic Component in an Enclosure Enhanced by Heat Sink: Part I: Comparison of experimental and Numerical Results”

Faculty of Engineering

Assiut University

Three Dimensional Transient Cooling of electronic Component in an Enclosure Enhanced by Heat Sink: Part I: Comparison of experimental and Numerical Results”

Research Authors
H. Hassan, I.S. Taha, N.Y. Abdel Shafey, and A.Y. Turk
Research Member
Hamdy Abo Ali Hassan Ibrahim
Research Year
2002
Research Journal
Journal of Engineering Science, Faculty of Engineering, Assiut University, Egypt
Research Vol
30(4)
Research Rank
2