Three Dimensional Transient Cooling of electronic Component in an Enclosure Enhanced by Heat Sink: Part I: Comparison of experimental and Numerical Results

Faculty of Engineering

Assiut University

Three Dimensional Transient Cooling of electronic Component in an Enclosure Enhanced by Heat Sink: Part I: Comparison of experimental and Numerical Results

Research Authors
1- H. Hassan, I.S. Taha, N.Y. Abdel Shafey, and A.Y. Turk
Research Member
Ibrahim Mohammad Shafie Taha
Research Year
2002
Research Journal
Journal of Engineering Science
Research Publisher
Faculty of Engineering, Assiut University, Egypt
Research Vol
Vol. 30, No. 4
Research Rank
2