Repair techniques for aged TSVs in 3D integrated circuits

Faculty of Engineering

Assiut University

Repair techniques for aged TSVs in 3D integrated circuits

Research Authors
Siroos Madani, Kasem Khalil, Bappaditya Dey, Devante Bonton, Magdy Bayoumi
Research Member
Kasem Mohamed Ahmed Khalil
Research Department
Electrical Engineering Department
Research Year
2017
Research Journal
2017 IEEE International High Level Design Validation and Test Workshop (HLDVT)
Research Publisher
IEEE
Research Vol
NULL
Research Rank
3
Research_Pages
53-58
Research Website
NULL
Research Abstract

NULL