Three Dimensional Transient Cooling of electronic Component in an Enclosure Enhanced by Heat Sink: Part II: Parametric Study

كلية الهندسة

مؤلف البحث

H. Hassan, I.S. Taha, N.Y. Abdel Shafey, and A.Y. Turk

المشارك في البحث

Hamdy Abo Ali Hassan Ibrahim

سنة البحث

2004

مجلة البحث

Journal of Engineering Science, Faculty of Engineering, Assiut University, Egyp

عدد البحث

32(2)

تصنيف البحث

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كلية الهندسة